Thermal Shock Chamber GT-F56

Thermal Shock Chamber Manufacturers Suppliers

Brand:
GESTER
Item NO.:
GT-F56
Order(MOQ):
1
Payment:
T/T, L/C
Lead Time：
25 days

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Product Detail

Thermal Shock Test Chamber GT-F56

Product Introduction of the thermal shock tester

Application:

The Thermal Shock Tester (2 Chambers) is to test the chemical changes or physical damage of composite materials after they undergo extreme changes in temperature.

It’s widely used in industries such as electronics and electrical components, automation parts, communication components, automotive parts, metals, chemical materials, plastics, and so on. It is commonly used to test the physical changes in materials used in defense industry, aerospace, military industry, BGA, PCB substrates, electronic chips IC, semiconductor ceramics, and polymer materials.

Feature:

Two test chamber divided into high-temp and low-temp area. The specimen will move between the 2 areas when impact.
Touch screen figure control interface is easy operation.

Standards:

GJB150.3-86; GJB150.4-86; GJB150.5-86;

GB-2423.1-2008(IEC68-2-1)A: Low Temperature Testing Method

GB-2423.2-2008(IEC68-2-2)B: High Temperature Testing Method

GJB360.8-2009(MIL-STD.202F)High temperature life test

GJBl50.3-2009(MIL-STD-810D)High temperature life test

Key Specifications of the thermal shock chamber

Model	GT-F56A
Outside dimensions (WHD)	1300 * 2050 * 1500 mm
Basket dimensions (WHD)	600 * 500 * 500 mm
Temperature of the high-temperature chamber	RT +10~180℃
Rise time of the high-temperature chamber	RT ~180℃ ≤45min
Temperature of the low-temperature chamber	-60~45℃
Rise time of the low-temperature chamber	RT ~125℃ ≤45min RT ~-60℃ ≤70min
Temperature uniformity	±2.0℃
Temperature fluctuation	±0.5℃