Thermal Shock Test Chamber GT-F56

Application:

The Thermal Shock Tester (2 Chambers) is to test the chemical changes or physical damage of composite materials after they undergo extreme changes in temperature.

It’s widely used in industries such as electronics and electrical components, automation parts, communication components, automotive parts, metals, chemical materials, plastics, and so on. It is commonly used to test the physical changes in materials used in defense industry, aerospace, military industry, BGA, PCB substrates, electronic chips IC, semiconductor ceramics, and polymer materials.

Feature:

1. Two test chamber divided into high-temp and low-temp area. The specimen will move between the 2 areas when impact.
2. Touch screen figure control interface is easy operation.

Standards:

GJB150.3-86; GJB150.4-86; GJB150.5-86;

GB-2423.1-2008(IEC68-2-1)A: Low Temperature Testing Method

GB-2423.2-2008(IEC68-2-2)B: High Temperature Testing Method

GJB360.8-2009(MIL-STD.202F)High temperature life test

GJBl50.3-2009(MIL-STD-810D)High temperature life test