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Thermal Shock Chamber GT-F56

Thermal Shock Chamber Manufacturers Suppliers
  • Brand:

    GESTER
  • Item NO.:

    GT-F56
  • Order(MOQ):

    1
  • Payment:

    T/T, L/C
  • Lead Time:

    25 days
  • Product Detail

Thermal Shock Test Chamber GT-F56


Product Introduction of the thermal shock tester


Application:

The Thermal Shock Tester (2 Chambers) is to test the chemical changes or physical damage of composite materials after they undergo extreme changes in temperature.

It’s widely used in industries such as electronics and electrical components, automation parts, communication components, automotive parts, metals, chemical materials, plastics, and so on. It is commonly used to test the physical changes in materials used in defense industry, aerospace, military industry, BGA, PCB substrates, electronic chips IC, semiconductor ceramics, and polymer materials.

Feature:

  1. Two test chamber divided into high-temp and low-temp area. The specimen will move between the 2 areas when impact.
  2. Touch screen figure control interface is easy operation.

Standards:

GJB150.3-86; GJB150.4-86; GJB150.5-86;

GB-2423.1-2008(IEC68-2-1)A: Low Temperature Testing Method

GB-2423.2-2008(IEC68-2-2)B: High Temperature Testing Method

GJB360.8-2009(MIL-STD.202F)High temperature life test

GJBl50.3-2009(MIL-STD-810D)High temperature life test


Key Specifications of the thermal shock chamber

 

Model

GT-F56A

Outside dimensions  (W*H*D)

1300 * 2050 * 1500  mm

Basket dimensions   (W*H*D)

600 * 500 * 500  mm

Temperature of the high-temperature chamber

RT +10~180

Rise time of the high-temperature chamber

RT ~180 ≤45min

Temperature of the low-temperature chamber

-60~45

Rise time of the low-temperature chamber

RT ~125 ≤45min

RT ~-60 ≤70min

Temperature uniformity

±2.0℃

Temperature fluctuation

±0.5℃


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