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Thermal Shock Chamber GT-F56

Thermal Shock Chamber is used to test the capability of material to withstand the continuous environmental changes.
  • Brand:

    GESTER
  • Item NO.:

    GT-F56
  • Order(MOQ):

    1
  • Payment:

    T/T, L/C
  • Shipping Port:

    Xiamen Port
  • Lead Time:

    15-30 days
  • Product Detail

Thermal Shock Chamber GT-F56


Application of thermal shock chamber

This Thermal Shock Chamber is prohibited to flammable, explosive, easy to volatile substances sample test or storage, corrosive substance sample test or storage, biological sample test or storage, strong electromagnetic emission source sample test or storage.


Thermal Shock Test Chamber is used to test the capability of material structure or composite materials to withstand the continuous environmental changes between extremely high temperature and low temperature during a short period, and therefore understand the chemical changes or physical damages caused by expansion from heat and contraction from cold in the shortest possible time. It is applicable to metals, plastic, rubber, electronics amongst other materials. The thermal shock test result can be used as a reference or basis for product improvement.


Structure of thermal shock chamber

1.  Heat preservation envelop enclosure:

     Outer wall material: cold-roll steel sheet stoving varnish.

     Inwall material:  stainless steel plate SUS304.

     Body heat preservation material: rigid polyurethane foam and glass fiber.

     Door heat preservation material:  glass fiber.

2.  Air conditioning channel: Fan, heater, evaporator, air door and temperature sensor.

3.  The standard configuration of chamber body: a lead drilling hole, locate on the left surface of the chamber body, φ50mm round hole. 

4.  load capacity of test chamber basket (uniform distribution):  2 sample basket, 5kg load capacity each (uniform distribution).

5.  Adjusting foot and adjusting wheel: 4 adjusting feet to support the test chamber, 4 adjusting wheels to move the test chamber.

6.  Thermal shock testing machine door: single open, left hinge, right handle (reference of Test chamber outline drawing).

7.  Circulating fan:   

      High temperature/ring temperature exposure: 3φ, 400W, centrifugal

      Low temperature exposure:  3φ,400W, centrifugal

8.  Control panel: Controller display screen, failure indicator, hour meter, R232 interface and over temperature protection setting device, total power switch.

9.  Thermal shock test machine room: Refrigeration unit, drainage device, exhaust fan.

10. Power distribution control cabinet: main power leakage circuit breaker, controller, power distribution board, cooling fan, high and low temperature circle back fan motor.

11. Heater: Nickel chromium alloy strip heater, 

12. Heater control mode: non-contacting periodic pulse width, SSR (solid-state relay).

13. Power line hole and drain hole: at the back of the chamber.


Key Specification of thermal shock tester


Temperature range of test area

-40℃~150℃, -60℃~150℃, -65℃~150℃  ( option)

High temperature range: +60℃~150℃

Low temperature range: -10℃~150℃

Testing environment condition

Environment temperature: +28℃

Relative humidity: ≤ 85%

In the condition of without sample in the sample chamber

Preheating temperature range

+60℃+150℃

Heating up time

+60℃→+150℃ 

≤ 40min

Note: The heating up time is the performance when

      the high temperature chamber individually operates.

Low temperature chamber

Note: The heating up time is the performance when

      the high temperature chamber individually operates.

Pre-cooling temperature range

-55℃-10℃

Cooling time

+20℃→  -55℃≤ 70min

Note: The cooling time is the performance when

      the low temperature chamber individually operates.

Testing method

Switch pneumatic ventilation door 2 or 3 temperature zones.

Temperature shock range

-40℃+150℃

Temperature fluctuation

±0.5℃

Temperature departure

±2.0℃

Temperature recovery time

≤ 5min

Recovery condition     

 

 

 

Sample: plastic packaged integrated circuit(uniformly distribute)

Sensor: the upper side of the sample

High temperature exposure: +150℃ 30 minutes

Environment temperature exposure: ---

Low temperature exposure: -40℃ 30 minutes

Sample weight: 2.5kg 


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